Patent attributes
The present invention discloses a wireless chip comprising a circuit layer above which a microstrip antenna is provided, and a wave-absorbing body is provided between the circuit layer and the microstrip antenna. Since the microstrip antenna is disposed above the circuit layer, the wave-absorbing body capable of absorbing energy is utilized to isolate the circuit from the antenna, and the metal film in the microstrip antenna functions not only as the RF ground of the antenna but also as a shield against any interference, it is possible to effectively address the problem of the antenna interfering with the circuit; by selecting the medium with suitable dielectric constant, the height of the chip can be prevented from being unduly increased, thereby ensuring that the chip and the wireless device using the same are both small in size. The present invention also discloses the wireless device containing the wireless chip.
