Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yung-Chou Li0
Date of Patent
July 5, 2011
0Patent Application Number
124859290
Date Filed
June 17, 2009
0Patent Primary Examiner
Patent abstract
A heat sink for a printed circuit board of power server includes at least one soldering portion. The heat sink is soldered to the printed circuit board at the soldering portion by a lead-free tin soldering process. A plurality of protruding structures protrudes from the soldering portion uniformly. The protruding structures are beneficial for getting a better soldering quality.
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