US Patent 7976342 High density rectangular interconnect

A high density rectangular electrical interconnect is disclosed that includes a plug having a plurality of plug contacts mated to a receptacle having a plurality of spring contacts preloaded with an opening force to reduce mating force. The plurality of plug contacts may be a plurality of pin contacts, printed circuit board traces, or flexible film contacts. The plug and receptacle may include shields and/or shielding material that form a continuous shield around the mated plug and spring contacts.