US Patent 7976732 Electroconductive composition and electroconductive film forming method

An electroconductive composition including a mixture of a copper powder having an averaged particle size between 0.3 and 20 μm and a copper fine powder having an averaged particle size between 1 and 50 nm; a solvent comprising a multivalent alcohol, such as ethylene glycol or diethylene glycol, having two or more OH groups; and an additive comprising a compound such as malic acid or citric acid having two or more COOH groups and one or more OH groups where the number of COOH groups is equal to or greater than the number of OH groups.