Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Henry Descalzo Bathan0
Zigmund Ramirez Camacho0
Lionel Chien Hui Tay0
Date of Patent
July 12, 2011
0Patent Application Number
117446970
Date Filed
May 4, 2007
0Patent Primary Examiner
Patent abstract
An integrated circuit package system is provided including forming an integrated circuit die, forming an interference-fit feature in the integrated circuit die, fitting a support element within the interference-fit feature, connecting an external interconnect and the integrated circuit die, and encapsulating the integrated circuit die.
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