US Patent 7981698 Removal of integrated circuits from packages
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Edits on 28 Nov, 2023
Golden AI
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Patent abstract
Packaging is substantially entirely removed from an integrated circuit die. The method allows the batch processing of several integrated circuit dies, such that packaging is removed from each die approximately simultaneously.
Edits on 14 Jul, 2023
Golden AI
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US Patent 07981698 Removal of integrated circuits from packages US Patent 7981698 Removal of integrated circuits from packages
Infobox
Patent Number
0798169800
Patent Number
798169800
Edits on 23 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
079816980
Date of Patent
July 19, 2011
0Patent Application Number
117162210
Date Filed
March 9, 2007
0Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
079816980
Date of Patent
July 19, 2011
0Patent Application Number
117162210
Date Filed
March 9, 2007
0Patent Primary Examiner
Edits on 8 Dec, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 07981698 Removal of integrated circuits from packages
Infobox
Is a
Patent jurisdiction
Patent number
07981698
Date of patent
July 19, 2011
Patent application number
11716221
Date Filed
March 9, 2007
Patent primary examiner
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