Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Henry Xu0
Xiang Yin Zeng0
John J. Tang0
Jianmin Li0
Date of Patent
July 19, 2011
0Patent Application Number
113016060
Date Filed
December 12, 2005
0Patent Primary Examiner
Patent abstract
An embodiment of the present invention is a technique to construct a multi-die package. A stack of dice is formed from a base substrate in a package. The dice are positioned one on top of another and have copper plated segments for die interconnection. The dice are interconnected using copper plating to connect the copper plated segments.
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