Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 19, 2011
Patent Application Number
12382293
Date Filed
March 12, 2009
Patent Primary Examiner
Patent abstract
A coreless substrate having a plurality of function pads, etched from a metal sheet and having a protruded shape; an insulating layer, the insulating layer being formed on one side of the function pads, a circuit corresponding to a pattern being formed on the insulating layer, a via hole being formed on the insulating layer to electrically connect the function pads and the circuit; and a solder resist, being formed on the insulating layer to protect the surface of the insulating layer. The coreless substrate has a signal delivery characteristic that is improved by eliminating the inner via hole.
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