US Patent 7982138 Method of nickel-gold plating and printed circuit board
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Edits on 28 Nov, 2023
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Patent abstract
Disclosed are a method of electroless nickel-gold plating an object and a printed circuit board. The method in accordance with an embodiment of the present invention includes: forming a first nickel plated layer on a surface of the object; forming a second nickel plated layer on the first nickel plated layer; and forming a gold plated layer on the second nickel plated layer.
Edits on 19 Sep, 2023
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Patent Inventor Names
Bae-Kyun Kim0
Eun-Ju Yang0
Jin-Hak Choi0
Jong-Yun Kim0
Seoung-Jae Lee0
Yeo-Joo Yoon0
Edits on 24 May, 2023
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US Patent 07982138 Method of nickel-gold plating and printed circuit board US Patent 7982138 Method of nickel-gold plating and printed circuit board
Infobox
Patent Number
079821380
Patent Number
79821380
Edits on 26 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
079821380
Date of Patent
July 19, 2011
0Patent Application Number
123691430
Date Filed
February 11, 2009
0Patent Primary Examiner
Edits on 8 Dec, 2021
Golden AI
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Infobox (+7 properties)
US Patent 07982138 Method of nickel-gold plating and printed circuit board
Infobox
Is a
Patent jurisdiction
Patent number
07982138
Date of patent
July 19, 2011
Patent application number
12369143
Date Filed
February 11, 2009
Patent primary examiner
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