Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
July 19, 2011
Patent Application Number
12024344
Date Filed
February 1, 2008
Patent Primary Examiner
Patent abstract
The semiconductor device includes a semiconductor element, a lead frame electrically connected to the semiconductor element, and a package having an opening in a front surface with a part of the lead frame protruding from a bottom surface. The protruding lead frame branches into a plurality of end portions, and the end portions are bent to be positioned respectively on a side surface and one of a back surface and a bottom surface of the package.
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