US Patent 7985470 Diamond sintered compact
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Patent abstract
An object is to raise both the wear resistance and chipping resistance of diamond sintered compacts while taking advantage of the characteristics of highly chipping-resistant microfine-grain diamond sintered compacts. A sintered diamond layer 3 is formed by sintering diamond grains and a binder on a cemented carbide substrate 2. This sintered diamond layer 3 comprises a main diamond layer 4 and a Co-rich diamond layer 5 that is present between the main diamond layer 4 and the cemented carbide substrate 2 and that has a Co content larger than that of the main diamond layer 4; the main diamond layer has a residual compressive stress of 1.5 GPa to 3 GPa.
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Patent Inventor Names
Satoru Kukino0
Tomohiro Fukaya0
Yoshihiro Kuroda0
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US Patent 07985470 Diamond sintered compact US Patent 7985470 Diamond sintered compact
Infobox
Patent Number
079854700
Patent Number
79854700
Edits on 27 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
079854700
Date of Patent
July 26, 2011
0Patent Application Number
118864330
Date Filed
February 2, 2007
0Patent Primary Examiner
Edits on 8 Dec, 2021
Golden AI
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Infobox (+7 properties)
US Patent 07985470 Diamond sintered compact
Infobox
Is a
Patent jurisdiction
Patent number
07985470
Date of patent
July 26, 2011
Patent application number
11886433
Date Filed
February 2, 2007
Patent primary examiner
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