US Patent 7985627 Thermal intermediate apparatus, systems, and methods
Patent 7985627 was granted and assigned to Intel on July, 2011 by the United States Patent and Trademark Office.
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Patent abstract
Apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure comprised of a plurality of carbon nanotubes some of which have organic moieties attached thereto to tether the nanotubes to at least one of a die and a heat sink. The organic moieties include thiol linkers and amide linkers.
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US Patent 07985627 Thermal intermediate apparatus, systems, and methods US Patent 7985627 Thermal intermediate apparatus, systems, and methods
Infobox
Patent Number
0798562700
Patent Number
798562700
Edits on 25 Apr, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079856270
Date of Patent
July 26, 2011
0Patent Application Number
122770750
Date Filed
November 24, 2008
0Patent Primary Examiner
Edits on 28 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079856270
Date of Patent
July 26, 2011
0Patent Application Number
122770750
Date Filed
November 24, 2008
0Patent Primary Examiner
Edits on 8 Dec, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 07985627 Thermal intermediate apparatus, systems, and methods
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07985627
Date of patent
July 26, 2011
Patent application number
12277075
Date Filed
November 24, 2008
Patent primary examiner
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