Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Katsumi Otani0
Date of Patent
August 2, 2011
0Patent Application Number
120417930
Date Filed
March 4, 2008
0Patent Primary Examiner
Patent abstract
A semiconductor device includes a semiconductor element 1, a thermal conductor 91 located opposite a major surface of the semiconductor element 1, and a mold resin member 6 molding the semiconductor element 1 and at least a part of the thermal conductor 91, wherein at least a part of a top surface of the thermal conductor 91 has an exposed portion exposed from the mold resin member 6, the exposed portion of the thermal conductor 91 has an opening 11, and a periphery of the opening 11 forms a projecting portion 91b projecting toward an opposite side of the semiconductor element 1.
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