Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yong Li Xu0
S. Kaysar Rahim0
Tiao Zhou0
Viren Khandekar0
Arkadii Samoilov0
Date of Patent
August 2, 2011
0Patent Application Number
126160770
Date Filed
November 10, 2009
0Patent Primary Examiner
Patent abstract
An enhanced redistribution layer is provided that geometrically expands redistribution layer (RDL) pads associated with a ball grid array of a wafer level package (WLP) to provide tensile stress relief during temperature cycle and/or drop testing of the WLP.
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