Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 2, 2011
Patent Application Number
11698480
Date Filed
January 25, 2007
Patent Primary Examiner
Patent abstract
A hermetic package for electronic components which is made of metallic silicon is disclosed. The package includes a plurality of silicon elements which are bonded together. In the first embodiment, a cavity is hollowed out in the cover to house the Application Specific Integrated Circuit oscillator and the resonator. In a second embodiment, the cavity is formed in the base member with a plurality of pedestal shelves to hold the resonator above and out of contact with the electrical circuitry for the oscillator and thermal controls.
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