Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Zigmund Ramirez Camacho0
Arnel Trasporto0
Henry D. Bathan0
Jeffrey D. Punzalan0
Date of Patent
August 9, 2011
0Patent Application Number
114593250
Date Filed
July 21, 2006
0Patent Primary Examiner
Patent abstract
An integrated circuit package system with laminate base is provided including forming a base package including, forming a laminate substrate strip, mounting an integrated circuit on the laminate substrate strip, forming a molded cover over the integrated circuit and the laminate substrate strip, and performing a strip test of the base package; attaching a bare die to the base package; connecting electrically the bare die to the laminate substrate strip; and encapsulating the bare die and the base package.
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