US Patent 7993984 Electronic device and manufacturing method
Patent 7993984 was granted and assigned to Panasonic on August, 2011 by the United States Patent and Trademark Office.
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An electronic device including a semiconductor device with a plurality of bump electrodes, a mounting board connected to the semiconductor device, thermally expandable particles, and adhesive. The thermally expandable particles are provided on the sides of the semiconductor device and the surface of the mounting board around a projected area of the semiconductor device. The adhesive is provided on the sides of the semiconductor device and the surface of the mounting board such that it covers the area of thermally expandable particles. This improves the impact resistance of the semiconductor device soldered onto the mounting board, and also facilitates removal of the semiconductor device from the mounting board when the semiconductor device needs repair.
US Patent 07993984 Electronic device and manufacturing method US Patent 7993984 Electronic device and manufacturing method
US Patent 07993984 Electronic device and manufacturing method
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