Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yukihiko Toyoda0
Motoo Asai0
Shinichiro Ichikawa0
Tohru Nakai0
Dongdong Wang0
Honchin En0
Kenichi Shimada0
Koji Sekine0
...
Date of Patent
August 9, 2011
Patent Application Number
12409670
Date Filed
March 24, 2009
Patent Primary Examiner
Patent abstract
A multilayer printed circuit board including a substrate board and a built-up structure formed over the substrate board. The built-up structure includes conductor circuits and resin insulating layers. The built-up structure has via holes interconnecting the conductor circuits through one or more resin insulating layers. The via holes are filled up with plating, and the resin insulating layers is formed of a cycloolefin resin.
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