Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 9, 2011
Patent Application Number
12263522
Date Filed
November 3, 2008
Patent Primary Examiner
Patent abstract
A semiconductor device may include a chip including a chip including a silicon substrate having a semiconductor device area, a pad area and a scribe lane defining an outer contour of the chip. A semiconductor device may be formed in the semiconductor device area, and a pad electrically connected with the semiconductor device may be formed in the pad area. A crack prevention pattern may be formed on an outer contour of the chip, such that the crack prevention pattern extends from a lowest portion to a highest portion of the semiconductor device. A crack prevention pattern is manufactured such that chip cracking can be prevented during the sawing process.
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