Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Rajendra D. Pendse0
Date of Patent
August 9, 2011
0Patent Application Number
108499470
Date Filed
May 20, 2004
0Patent Primary Examiner
Patent abstract
A flip chip interconnection structure is formed by mechanically interlocking joining surfaces of a first and second element. The first element, which may be a bump on an integrated circuit chip, includes a soft, deformable material with a low yield strength and high elongation to failure. The surface of the second element, which may for example be a substrate pad, is provided with asperities into which the first element deforms plastically under pressure to form the mechanical interlock.
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