US Patent 7997114 Method of stamping multilayer sheets
Patent 7997114 was granted and assigned to Material Sciences Corporation on August, 2011 by the United States Patent and Trademark Office.
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Patent abstract
A method includes providing a sheet having layers characterized by different softnesses, providing a die component having a leading surface that is generally concave, and causing the leading surface to puncture the sheet thereby to cut a part from the sheet. The method provides improved flatness of parts cut from sheets having layers of varying softness and prevents soft material from exiting the sheet because the peripheral edge of the leading surface applies maximum pressure to the sheet during the puncturing step.
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Patent Inventor Names
Andreas Hüther0
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US Patent 07997114 Method of stamping multilayer sheets US Patent 7997114 Method of stamping multilayer sheets
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Patent Number
07997114
Patent Number
7997114
Edits on 8 Dec, 2021
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US Patent 07997114 Method of stamping multilayer sheets
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Is a
Current assignee
Patent jurisdiction
Patent number
07997114
Date of patent
August 16, 2011
Patent application number
11697031
Date Filed
April 5, 2007
Patent primary examiner
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