A bonding device for providing an electrical ground to a plurality of remote devices from a main junction box with a main ground cable. The bonding device includes an elongated electrically conductive housing having a through passage for receiving therethrough the main ground cable. The electrically conductive housing further includes a plurality of passage holes that each extend substantially transverse to the elongated through passage, and with each of the passage holes for receiving a ground wire associated with one of the remote devices. Fasteners retain the ground wire in each corresponding passage hole.