US Patent 7998332 Electroplating method
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Patent abstract
An electroplating method includes steps of: providing a substrate having a first portion and a second portion connected to the first portion; forming a metallic layer on a surface of the second portion; immersing the first portion of the substrate in an electrolyte solution, applying a current to the metallic layer to electroplate the first portion of the substrate with a metal layer; and moving the substrate in a direction away from the electrolyte solution during electroplating the first portion of the substrate. The method can improve a uniformity of the obtained plating layer.
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Patent Inventor Names
Qiu-Yue Zhang0
Rui Zhang0
Shing-Tza Liou0
Yao-Wen Bai0
Edits on 24 May, 2023
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US Patent 07998332 Electroplating method US Patent 7998332 Electroplating method
Infobox
Patent Number
079983320
Patent Number
79983320
Edits on 31 Mar, 2023
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Infobox
Is a
Patent Jurisdiction
Patent Number
079983320
Date of Patent
August 16, 2011
0Patent Application Number
121644290
Date Filed
June 30, 2008
0Patent Primary Examiner
Edits on 8 Dec, 2021
Golden AI
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US Patent 07998332 Electroplating method
Infobox
Is a
Patent jurisdiction
Patent number
07998332
Date of patent
August 16, 2011
Patent application number
12164429
Date Filed
June 30, 2008
Patent primary examiner
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