Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 16, 2011
Patent Application Number
12539939
Date Filed
August 12, 2009
Patent Primary Examiner
Patent abstract
This invention is directed to provide a method of manufacturing a resin molded semiconductor device with high reliability by preventing a resin leakage portion from occurring due to burrs on a lead frame formed by punching. The method of manufacturing the resin molded semiconductor device according to the invention includes bonding a semiconductor die on an island in a lead frame, electrically connecting the semiconductor die with the lead frame, resin-molding the lead frame on which the semiconductor die is bonded, and applying prior to the resin-molding a compressive pressure that is higher than a clamping pressure applied in the resin-molding to a region of the lead frame being clamped by molds in the resin-molding of the lead frame.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
