US Patent 7998861 Method of manufacturing through-via
Patent 7998861 was granted and assigned to Electronics and Telecommunications Research Institute on August, 2011 by the United States Patent and Trademark Office.
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Patent abstract
Disclosed is a method of manufacturing a through-via. The through-via manufacturing method includes forming a core-via hole in a wafer, forming a suction-via hole adjacent to the core-via hole in the wafer, forming a via core in the core-via hole, forming a polymer-via hole connected to the suction-via hole in the wafer, filling the polymer-via hole with polymer solution by creating a vacuum inside the polymer-via hole by drawing air out of the suction-via hole, and polishing the wafer such that the via core formed in the core-via hole is exposed.
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Patent Inventor Names
Hyun-seo Kang0
Jai-sang Koh0
Jong-jin Lee0
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Patent Citations Received
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US Patent 07998861 Method of manufacturing through-via US Patent 7998861 Method of manufacturing through-via
Infobox
Patent Number
07998861
Patent Number
7998861
Edits on 8 Dec, 2021
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US Patent 07998861 Method of manufacturing through-via
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Is a
Current assignee
Patent jurisdiction
Patent number
07998861
Date of patent
August 16, 2011
Patent application number
12604355
Date Filed
October 22, 2009
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