Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yoshiyasu Isobe0
Kunihiro Naoe0
Date of Patent
August 16, 2011
0Patent Application Number
124093500
Date Filed
March 23, 2009
0Patent Primary Examiner
Patent abstract
Disclosed is a plated flat conductor including a flat conductor of copper or a copper alloy and a plated layer formed on a surface of the flat conductor. The plated layer includes a first intermetallic compound layer of Cu3Sn disposed on the surface of the flat conductor, a second intermetallic compound layer of Cu6Sn5 formed on the first intermetallic compound, and a superficial layer formed on the second intermetallic compound layer. The superficial layer is plating material of pure tin or a tin alloy and has an average thickness from about 0.3 μm to 1.0 μm and a maximum thickness of about 1.0 μm or less. A volume ratio of the second intermetallic compound layer to the first intermetallic compound layer is about 1.5 or more.
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