Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
August 16, 2011
Patent Application Number
11835247
Date Filed
August 7, 2007
Patent Primary Examiner
Patent abstract
A lead frame structure for supporting a semiconductor die is disclosed that includes at least two electrical leads each having a plurality of finger shaped structures unilaterally extending outward from the at least two electrical leads. The electrical leads are arranged so that the plurality of finger shaped structures forms inter-digital patterns where the semiconductor dies are bonded to the lead frame structure.
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