A heat dissipation assembly comprises a heat sink for being disposed on an electronic component mounted on a printed circuit board, and a pair of fasteners for securing the heat sink on the printed circuit board. Each fastener comprises a sleeve extending through the printed circuit board, a latch received in the sleeve, a stretchable pole inserted through the sleeve and a handle pivotably fixed to the pole. The pole is raised by rotation of the handle to a locked position. At the locked position, the handle downwardly acts on the heat sink, and the pole pushes the latch out of the sleeve. The latch presses against the printed circuit board upwardly to realize an intimate contact between the heat sink and the electronic component.