US Patent 8003193 Functional device
Patent 8003193 was granted and assigned to Hitachi on August, 2011 by the United States Patent and Trademark Office.
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Edits on 28 Nov, 2023
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Patent abstract
The present invention provides a low-cost MEMS functional device by improving air tightness of a jointed section by anode junction in wafer level packaging for MEMS based functional devices. The MEMS functional device comprises a function element section formed by processing a substrate mainly made of Si, a metallized film for sealing formed around the functional element, and a glass substrate jointed to the metallized film for sealing by anode junction. Formed on a surface of the metallized film for sealing is a metallized film containing at least one of Sn and Ti as a main component.
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US Patent 08003193 Functional device US Patent 8003193 Functional device
Infobox
Patent Number
0800319300
Patent Number
800319300
Edits on 28 Mar, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
080031930
Date of Patent
August 23, 2011
0Patent Application Number
119249240
Date Filed
October 26, 2007
0Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
080031930
Date of Patent
August 23, 2011
0Patent Application Number
119249240
Date Filed
October 26, 2007
0Patent Primary Examiner
Edits on 8 Dec, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 08003193 Functional device
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
08003193
Date of patent
August 23, 2011
Patent application number
11924924
Date Filed
October 26, 2007
Patent primary examiner
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