Patent attributes
A manufacturing method for a semiconductor device having patterns including two adjacent sides forming a corner portion with an external angle and a periodic pattern with a high density arrangement in the same layer is provided with (a) the step of exposing the first divided pattern including a first side which is obtained by dividing the pattern including two sides and the region which corresponds to a first thinned out pattern from which the periodic pattern is thinned out to light through a first mask having a first mask pattern, and (b) the step of exposing the second divided pattern including a second side which is obtained by dividing the pattern including two sides and the region which corresponds to a second thinned out pattern which is obtained by thinning out the periodic pattern to light through a first mask having a second mask pattern.
