Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tracy Autry0
Date of Patent
August 23, 2011
Patent Application Number
12589682
Date Filed
October 27, 2009
Patent Primary Examiner
Patent abstract
A single step packaging process that both melts a solder and also cures an adhesive about a microelectronic circuit. The process finds technical advantages by simplifying packaging of a die that may be coupled to a planar flexible lead, which leads to a lower production cost and quicker manufacturing time. The planar flexible lead may be adapted to bend and flex during mechanical stress and during extreme temperature cycling, and allow direct mounting of the device to a member by easily welding or soldering. The invention may comprise a flexible solar cell diode that can be closely positioned on solar panels at an extremely low cost.
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