US Patent 8003509 Semiconductor manufacturing apparatus and semiconductor manufacturing method
Patent 8003509 was granted and assigned to Tokyo Electron on August, 2011 by the United States Patent and Trademark Office.
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A plated film having a uniform film thickness is formed on a surface of a substrate. A semiconductor manufacturing apparatus includes: a holding mechanism for holding a substrate rotatably; a nozzle for supplying a processing solution for performing a plating process on a processing target surface of the substrate; a substrate rotating mechanism for rotating the substrate held by the holding mechanism in a direction along the processing target surface; a nozzle driving mechanism for moving the nozzle in a direction along the processing target surface at a position facing the processing target surface of the substrate held by the holding mechanism; and a control unit for controlling the supply of the processing solution by the nozzle and the movement of the nozzle by the nozzle driving mechanism.
US Patent 08003509 Semiconductor manufacturing apparatus and semiconductor manufacturing method US Patent 8003509 Semiconductor manufacturing apparatus and semiconductor manufacturing method
US Patent 08003509 Semiconductor manufacturing apparatus and semiconductor manufacturing method
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