Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Youhong Wu0
Date of Patent
August 23, 2011
0Patent Application Number
118326730
Date Filed
August 2, 2007
0Patent Primary Examiner
Patent abstract
A multi-layer printed wiring board has a core substrate, a first interlayer insulation layer formed over the core substrate, a first filled via formed in the first interlayer insulation layer, a second interlayer insulation layer formed over the first interlayer insulation layer, and a second filled via formed in the second interlayer insulation layer. The first filled via has a bottom portion having a first diameter. The second filled via has a bottom portion having a second diameter smaller than the first diameter.
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