US Patent 8004074 Semiconductor device and fabrication method
Patent 8004074 was granted and assigned to NEC Corporation on August, 2011 by the United States Patent and Trademark Office.
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Edits on 28 Nov, 2023
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Patent abstract
A semiconductor device, in which a semiconductor element is mounted on one side of a circuit board that is made up from an insulating layer and a wiring layer, includes metal posts provided on the side of the circuit board on which the semiconductor element is mounted; and a sealing layer provided on the side of the circuit board on which the semiconductor element is mounted such that the semiconductor element is covered and such that only portions of the metal posts are exposed.
Edits on 25 May, 2023
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US Patent 08004074 Semiconductor device and fabrication method US Patent 8004074 Semiconductor device and fabrication method
Infobox
Patent Number
0800407400
Patent Number
800407400
Edits on 4 Apr, 2023
Golden AI
Infobox
Is a
Current Assignee
0
Patent Jurisdiction
Patent Number
080040740
Date of Patent
August 23, 2011
0Patent Application Number
121024140
Date Filed
April 14, 2008
0Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
0
Patent Jurisdiction
Patent Number
080040740
Date of Patent
August 23, 2011
0Patent Application Number
121024140
Date Filed
April 14, 2008
0Patent Primary Examiner
Edits on 8 Dec, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 08004074 Semiconductor device and fabrication method
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
08004074
Date of patent
August 23, 2011
Patent application number
12102414
Date Filed
April 14, 2008
Patent primary examiner
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