Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Toru Imori0
Junnosuke Sekiguchi0
Date of Patent
August 23, 2011
0Patent Application Number
124491280
Date Filed
February 19, 2009
0Patent Primary Examiner
Patent abstract
It is an object of the present invention to provide a technology for forming an ULSI fine copper wiring by a simpler method. An electronic component in which a thin alloy film of tungsten and a noble metal used as a barrier-seed layer for an ULSI fine copper wiring is formed on a base material, wherein the thin alloy film has a composition comprising tungsten at a ratio equal to or greater than 60 at. % and the noble metal at a ratio of equal to or greater than 5 at. % and equal to or less than 40 at. %. The noble metal is preferably one or more kinds of metals selected from the group consisting of platinum, gold, silver and palladium.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
