Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kenji Fukuzono0
Date of Patent
August 23, 2011
Patent Application Number
11488640
Date Filed
July 19, 2006
Patent Primary Examiner
Patent abstract
A semiconductor device and a manufacturing method of the device are disclosed. The semiconductor device includes a substrate that mounts a semiconductor element, a first stiffener, a reinforcement resin member, and a second stiffener for reinforcing the reinforcement resin member.
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