Patent attributes
The invention relates to a method and a device for cooling ultrasonic transducers. The inventive device is characterised in that it consists of at least one piezo stack (4) and at least two cylindrical transducer bodies (5), which together with the piezo stack (4) form an λ/2 oscillator. In multiple transducer assemblies, two respective transducer bodies (5) can be combined to form a common transducer body (6) and the transducer bodies (5, 6) comprise flow channels (7), through which pressurised coolant can flow. The inventive method for cooling ultrasonic transducers is characterised in that the body of the ultrasonic transducer is traversed and/or surrounded by a pressurised coolant. This enables the heat that is generated in the transducers to be directly dissipated by convection. In addition the inventive elements enable the creation of a large common contact surface between the transducers and the coolant. The heat dissipation achieved is substantially more effective than in known methods and the inventive elements thus guarantee a high-performance continuous operation.