Patent attributes
A heat dissipation device for communication chassis, which includes an enclosure and at least one second heat pipe assembly. The enclosure includes at least one first copper heat absorption component, at least one first heat pipe assembly and multiple radiating fins disposed on an outer surface of the enclosure. The first heat pipe assembly is connected with the first copper heat absorption component and a section not in contact therewith so as to transfer heat absorbed by the first copper heat absorption component to the section to dissipate the heat. The second heat pipe assembly penetrates through the radiating fins of the enclosure for quickly and uniformly distributing the heat to all the radiating fins. Therefore, the heat conduction efficiency is greatly enhanced to provide better heat dissipation effect for the communication chassis.
