Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chun-Chi Chen0
Guo Chen0
Shi-Wen Zhou0
Date of Patent
August 23, 2011
Patent Application Number
12565712
Date Filed
September 23, 2009
Patent Primary Examiner
Patent abstract
A heat dissipation device is provided for dissipating heat generated by a plurality of electronic components mounted on a printed circuit board and having different heights. The heat dissipation device includes a connecting member and a first base mounted on the connecting member and located at above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the first base to assemble the first base on the one of the electronic components on the printed circuit board. A distance between the first base and the one of the electronic components is adjustable by adjusting the joining members to make the first base intimately contact with the one of the electronic components.
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