US Patent 8006747 Micro-chimney and thermosiphon die-level cooling
Patent 8006747 was granted and assigned to Intel on August, 2011 by the United States Patent and Trademark Office.
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Edits on 28 Nov, 2023
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Patent abstract
A semiconductor die is constructed and arranged to have at least one conduit portion therein. At least a portion of the conduit portion is proximate to the localized area. The conduit portion is at least partially filled with a heat-dissipating material. The conduit portion absorbs heat from the localized area and dissipates at least a portion of the heat away from the localized area.
Edits on 24 May, 2023
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US Patent 08006747 Micro-chimney and thermosiphon die-level cooling US Patent 8006747 Micro-chimney and thermosiphon die-level cooling
Infobox
Patent Number
0800674700
Patent Number
800674700
Edits on 28 Apr, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
080067470
Date of Patent
August 30, 2011
0Patent Application Number
123195050
Date Filed
January 8, 2009
0Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
080067470
Date of Patent
August 30, 2011
0Patent Application Number
123195050
Date Filed
January 8, 2009
0Patent Primary Examiner
Edits on 8 Dec, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 08006747 Micro-chimney and thermosiphon die-level cooling
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
08006747
Date of patent
August 30, 2011
Patent application number
12319505
Date Filed
January 8, 2009
Patent primary examiner
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