US Patent 8008133 Chip package with channel stiffener frame
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Edits on 28 Nov, 2023
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Patent abstract
Various semiconductor chip packages and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing a substrate that has a first side and a first plurality of passive devices on the first side. A stiffener frame is coupled on the first side. The stiffener frame has first and second spaced apart opposing walls that define a channel in which the first plurality of passive devices is positioned, and a central opening that does not cover a central portion of the first side of the substrate.
Edits on 20 May, 2023
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US Patent 08008133 Chip package with channel stiffener frame US Patent 8008133 Chip package with channel stiffener frame
Infobox
Patent Number
0800813300
Patent Number
800813300
Edits on 31 Mar, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
080081330
Date of Patent
August 30, 2011
0Patent Application Number
120293050
Date Filed
February 11, 2008
0Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
080081330
Date of Patent
August 30, 2011
0Patent Application Number
120293050
Date Filed
February 11, 2008
0Patent Primary Examiner
Edits on 8 Dec, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 08008133 Chip package with channel stiffener frame
Infobox
Is a
Patent jurisdiction
Patent number
08008133
Date of patent
August 30, 2011
Patent application number
12029305
Date Filed
February 11, 2008
Patent primary examiner
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