Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tim V. Pham0
Trent S. Uehling0
Date of Patent
August 30, 2011
0Patent Application Number
128284690
Date Filed
July 1, 2010
0Patent Primary Examiner
Patent abstract
A semiconductor device is provided which comprises a substrate (501) having a plurality of bond pads (503) disposed thereon. Each bond pad has a major axis and a minor axis in a direction parallel to the substrate, and the ratio of the major axis to the minor axis increases with the distance of a bond pad from the center of the substrate.
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