Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
September 6, 2011
Patent Application Number
12334519
Date Filed
December 15, 2008
Patent Primary Examiner
Patent abstract
A printhead assembly includes a molded ink manifold, a plurality of printhead integrated circuits, and an adhesive film sandwiched between the ink manifold and the printhead integrated circuits. A manifold bonding surface of the molded ink manifold includes a polymer coating. The polymer coating plugs fissures resulting from a molding process used to mold the ink manifold.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
