US Patent 8012856 Method of producing semiconductor components
Patent 8012856 was granted and assigned to Osram Opto Semiconductors GmbH on September, 2011 by the United States Patent and Trademark Office.
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A method is provided for producing a semiconductor component (1) comprising at least one semiconductor body (2) and one connection carrier region (5). A semiconductor layer sequence (20) with an active region (23) intended for generating radiation is deposited on a substrate (25). The semiconductor layer sequence is arranged on a first auxiliary carrier (3) and the substrate is removed. A plurality of semiconductor bodies are formed from the semiconductor layer sequence. A second auxiliary carrier (4) is arranged on the side of the semiconductor layer sequence remote from the first auxiliary carrier. The first auxiliary carrier is removed. A connection carrier (50) with a plurality of connection carrier regions (5) is provided. The second auxiliary carrier is positioned relative to the connection carrier in such a way that at least one of the semiconductor bodies overlaps an associated connection carrier region when viewed in plan view. The at least one semiconductor body is transferred onto the connection carrier region.
US Patent 08012856 Method of producing semiconductor components US Patent 8012856 Method of producing semiconductor components
US Patent 08012856 Method of producing semiconductor components
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