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US Patent 8014150 Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
June 25, 2009
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Date of Patent
September 6, 2011
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Patent Application Number
12491281
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Patent Citations Received
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US Patent 12137536 Systems and methods for autonomously activable redundant cooling of a heat generating component
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US Patent 11943904 Hybrid thermosyphon with immersion cooled evaporator
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US Patent 11985802 Control systems and prediction methods for it cooling performance in containment
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US Patent 11991857 Modular liquid cooling architecture for liquid cooling
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US Patent 12089370 Thermal management device for high density processing unit
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US Patent 12114468 High-availability liquid cooling system for chip and server
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US Patent 12120846 Immersion cooling systems for electronic components
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US Patent 11778790 Fluid cooling system
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US Patent 11785747 Methods and devices for testing immersion cooling controllers
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US Patent 11895804 Fluid breakdown detection systems and processes useful for liquid immersion cooling
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•••
Patent Inventor Names
Richard C. Chu
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Robert E. Simons
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Levi A. Campbell
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Madhusudan K. Iyengar
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Michael J. Ellsworth, Jr.
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
8014150
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Patent Primary Examiner
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Robert J Hoffberg
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