Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
September 20, 2011
Patent Application Number
12149741
Date Filed
May 7, 2008
Patent Citations Received
Patent Primary Examiner
Patent abstract
Example embodiments relate to semiconductor packages and methods of forming the same. A semiconductor package according to example embodiments may include a printed circuit board (PCB), a first semiconductor chip mounted on the PCB, and a chip package mounted on the first semiconductor chip. The chip package may be in direct contact with the first semiconductor chip.
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