Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 1, 2011
Patent Application Number
12504681
Date Filed
July 17, 2009
Patent Citations Received
Patent Primary Examiner
Patent abstract
A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. Two engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The heat pipe extends between the two engaging portions. The two engaging portions press two opposite ends of the clip downwardly, thereby securing the heat pipe to the top face of the heat-conducting board.
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