US Patent 8051672 Fluid cooled cabinet for electronic equipment

An electronic equipment cabinet is provided, which includes an enclosure defining an interior space. A support is disposed with the interior space and is configured to receive electronic equipment. The bottom portion defines a base plenum configured for at least one heat exchanger, which is in fluid communication with a low temperature fluid supply and a high temperature fluid return. A closed loop gas flow distribution pathway includes a first plenum communicating with the base plenum and configured to direct a low temperature gas to the support, and a second plenum configured to receive a high temperature gas flow from the support and direct the high temperature gas flow to the base plenum. A temperature sensor is disposed with the enclosure to sense the temperature of the high temperature gas flow within the enclosure.