US Patent 8057446 Wound healing device

Methods and devices transmit micromechanical forces locally on the millimeter to micron scale for promoting wound healing. Micromechanical forces can selectively be applied directly to tissue, in some embodiments, by using microchambers fluidically connected to microchannels. Each chamber, or in some cases, group of chambers, may be associated with a valve to control vacuum pressure, positive pressure, liquid delivery, and/or liquid removal from each chamber or group of chambers. Application of embodiments of the invention may shorten wound-healing time, reduce costs of therapy, enable restoration of functional tissue, and reduce the need for more invasive therapies, including surgery.