Patent attributes
A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. A pair of engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The clip secures the heat pipe to the top face of the heat-conducting board. The clip includes a pivoting portion which is pivotally fixed to the heat-conducting board, a clasping portion detachably engaging with the engaging portions, and a main body interconnecting the pivoting portion and the clasping portion and abutting against the heat pipe toward the heat-conducting board.